Exhibit spots are fully booked for this year's event, please register as a sponsor to reserve an exhibit table.
acam provides intelligent ASIC solutions for MEMS sensors. The versatile solutions can be used with a variety of sensors (e.g. capacitive or resistive) and are well suited for portable medical devices thanks to the very low current consumption. The high resolution and measurement rate of the chips make them perfect for the use in high-end applications. The on-board processing capability in form of a microprocessor allows for compact sensor fusion, e.g. to make the linearization of a pressure sensor directly on chip.
acam is a privately owned company with its headquarter located in the south of Germany. A worldwide distributor network assures local support with offices in North America, Europe and Asia.
Alpha Precision specializes in custom ultrasonic machining of wafers and high precision surface polishing for excellent anodic bonding for MEMS. The ultrasonic process results in high precision placement and tolerances of features on the MEMS wafer. Ultrasonic machining does not impart any substrate cracking, stress or temperature change. This process is applicable to many different brittle substrates such as glass and ceramic. End use features include through vias, cavities and grooves. ISO/TS 16949:2009 Certified Quality Process.
Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes.
Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash. This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials. In addition, Boschman serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications. By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.
The Case School of Engineering is nationally ranked as one of the top engineering schools with a 125-year history of excellence. The Department of Biomedical Engineering at Case Western Reserve University promotes human health through education and research that bridges the gap between medicine and engineering. Our faculty and students play leading roles ranging from basic science discovery to the creation, clinical evolution, and commercialization of new technologies, devices and therapies. In short, we are “Engineering Better Health”. Founded in 1968 as one of the pioneer programs in the world, we’ve established very successful and comprehensive programs in research and education. A cornerstone of our success has been active collaboration, which is embodied by intensive interactions between students and faculty in classrooms and research laboratories. Collaborations are also greatly facilitated by our prime location adjacent to the outstanding research and clinical resources within northeast Ohio.
Finetech's precision die bonders provide sub-micron placement accuracy and process modularity within one platform: thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing. Ideal solutions for advanced technology applications: flip chip, laser bars & diodes, VCSELs, MEMs, sensors, detectors, 3D, W2W / C2W, photonics packaging, and micro-optics assembly.
The Greater Geneva Berne area is a Swiss economic development agency representing the interest of six Swiss cantons (states) in Western Switzerland: Berne, Fribourg, Geneva, Neuchatel, Valais and Vaud. Surrounded by France, Germany and Italy, our region offers a welcoming environment for companies to collaborate, develop and commercialize their technologies on an international scale. With our dense and sophisticated life science and microtechnology clusters representing nearly 5000 companies, more than 500 labs, and 120,000 workers, these sectors have converged to create an academic and commercial environment of international renown in the MEMS, sensors, and high-tech biomedical sectors.
Companies are drawn to our region because of the potential for synergies and close collaboration with our unique institutions such as the Swiss Federal Institute of Technology (EPFL) with 19 specialized labs in microtechnology, the Swiss Center for Electronics and Microtechnology (CSEM), the Swiss Foundation for Research in Microtechnology, our six cantonal universities, and our three University Hospitals of Berne, Geneva, and Lausanne.
Research is a top priority in Switzerland where more scientific publications and patents are filed per capita than anywhere else in the world. Our region's above average spending on fundamental and applied research is the result of long-standing policies and initiatives to attract investment and collaboration in high value-added sectors.
We offer an accessible regulatory environment; an open clinical community; low taxes; an educated, multilingual, multicultural workforce; science parks and incubators; networking platforms; state-funded collaboration programs; and a world-class quality of life.
As a government sponsored association, our mission is to provide support and assistance to companies (MEMS, sensors, life sciences, etc.) interested in the benefits that Switzerland can bring to them. Our support ranges from facilitating relationships with potential partners to helping negotiate the regulatory environment to all aspects of establishing an enterprise in Switzerland. For more information, please contact Matt Julian at 512-301-3337 (office), 512-586-7035 (cell) or email@example.com (email).
Founded in 1984, Heidelberg Instruments is today a global leader in design, development and manufacturing of complex laser based maskless lithography systems. These systems are critical to fabrication of advanced photomasks and direct write solutions in the areas of Advanced Electronic Packaging, Flat Panel Display, MEMS, Integrated Optics and other micro and nano based applications.
Heidelberg Instruments’ customers include many of the major global nano and micro technology based corporations along with some of the leading research and development organizations that provide components used in an array of electronic, communication and information technology products.
Heidelberg Instruments is located in Heidelberg, Germany, with global customer support offices in Asia, Europe, and North America. The company is 100% privately owned by the management and employees.
Kent State University is internationally recognized for its biomedical research. Current research strengths across the many disciplines at Kent State are particularly compatible with the bioengineering fields of tissue regeneration, biomaterials, biocompatibility, sensors and implanted devices. Our researchers are developing transdermal implants for amputees, improving neural function with implanted electrodes, creating implanted sensors for monitoring blood chemistry and vital signs and designing drug delivery devices that can be implanted or worn on the skin. Our researchers are also developing new medical sensors using advanced organic and polymeric materials to measure biomarkers and other biochemical indicators of disease, injury and trauma. Other materials research focuses on improving the biocompatibility of materials, decreasing the risk of infection from implanted devices, producing Lab-on-a-Chip devices for diagnostic and therapeutic applications and creating a new generation of flexible electronic medical devices for implantation and other applications. Kent State is also known for its research strengths in flexible electronics and liquid crystals within its Liquid Crystal Institute™(LCI).
Nordson Corporation operates in more than 30 countries around the world delivering precision technology solutions to help customers succeed worldwide. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.
The National Nanotechnology Infrastructure Network (NNIN) is an integrated network of user facilities, supported by the National Science Foundation, serving the needs of nanoscale science, engineering and technology researchers across the country. The goal of the NNIN is to enable rapid advancement in science and engineering at the nanoscale by providing researchers with efficient access to nanotechnology infrastructure (fabrication, characterization and computational capabilities and facilities) and support from experienced staff members.
The Lurie Nanofabrication Facility (LNF) at the University of Michigan is one of the NNIN sites that offers 24/7 semiconductor processing capabilities on production-level equipment supported by a professional staff. With 1,160 m2 (12,500 ft2) of ISO class 4/5/6 and 7 (Class 10/100/1000 and 10,000) cleanrooms for processing pieces, 100 mm and 150 mm wafers, we have processing capabilities for silicon and organic devices, MEMs and bioMEMs, fluidics and biofluidics, and nanoimprint technologies.
With such an available suite of established technologies for a large range of applications, the LNF is ideal for rapid feasibility assessment of ideas and pilot/low-volume products. Whether you want to assess new process adjustments for your product without compromising your current process, explore new device directions, or simply take advantage of our advanced characterization capabilities, the LNF provides the complete cleanroom experience for your high tech needs. The LNF is also part of the National Nanotechnology Infrastructure Network (NNIN), an integrated network of user.
With over $20M in state-of-the-art equipment, we provide the training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online at http://lnf.umich.edu/index.php/capabilities.
Original Biomedical Implants, Inc. (OBI) was established in Texas with an initial focus of commercializing a new generation of dental drills and implants with a unique patented ultrananocrystalline diamond (UNCD) coating, which enables an order of magnitude superior performance over current products at competitive costs. After a return on investment (3 years), OBI will also commercialize high-revenue new generation medical devices such as MEMS drug delivery devices and biosensors, UNCD-coated prosthesis (e.g., hips, knees, stents), electrically conductive UNCD electrodes for neural stimulation, and much more. UNCD-based products will address the global health business which is projected to reach $365 billion per year in 2015 (Global Industry Analyst, February 2012).
The Premiere Electronics Job Shop
At RBB Systems, we specialize in on-demand manufacturing of mission-critical electronic assemblies for the industrial, commercial, medical and military sectors. By embracing small batch custom assemblies of electronic circuit boards, we allow clients greater flexibility in meeting fluctuating market demands.
We combine the best lean manufacturing principles with a hungry can-do attitude. Our cost-effective, team-driven approach offers a meaningful alternative to offshore production. Our organizational mission is simple: We exist to move heaven and earth to get our small batch customers what they need, when they need it.
If you need low-volume printed circuit board assembly to support second-tier product lines or other small batch industrial electronics work, we invite you to contact us to learn more about our services, philosophies and capabilities.
Specializing in MEMS and biomedical device fabrication, Rogue Valley Microdevices is a full service MEMS foundry that combines state-of-the-art process modules with the engineering experience and expertise to seamlessly go from custom design to device manufacturing. With our extensive list of process capabilities, all front-end processing is performed in house. Maintaining all MEMS process capabilities in house enables us to decrease manufacturing lead-times while improving device yield and performance.
Rogue Valley Microdevices offers over 50 unique MEMS manufacturing and thin film processes to support our worldwide customer base. Our MEMS and thin film processes are designed to handle silicon wafer substrates, as well as a variety of other material such as quartz, glass and aluminum nitride wafers. Our goal is to minimize process development time, keeping your cost and lead-time to a minimum. We have extensive MEMS manufacturing experience and understand how important it is to have a robust and repeatable process.
Rogue Valley Microdevices is based in beautiful Southern Oregon. We supply services to customers with a wide variety of applications, including those in MEMS, semiconductors, biotechnology and nanotechnology. To contact us, please go to: http://www.roguevalleymicro.com/contact.php.
Semefab is a volume foundry supporting an extensive process portfolio of MEMS, MOS, bipolar, opto-CMOS, ASIC and discrete technologies and supplies silicon wafers, die and packaged devices to the market. Semefab operates its own 6-inch and 4-inch volume foundries with complete autonomy between its MEMS and MOS/bipolar fabs.
Semefab also supports wafer and package test in its facilities. Supporting a commercialization business model, Semefab optimizes device structures and process flows within an ISO accredited environment and seamlessly transfers these into its volume foundries. As a global foundry, Semefab exports more than 74% of its fabricated product and ships more than 200 million die per year.
TECNISCO, LTD. is a subsidiary of Disco Corporation, a worldwide manufacturer of dicing saws and grinding machines. They supply customized parts that are manufactured with Glass, Metal, Ceramic, or Silicon by its advanced high-precision processes and composite technologies for the MEMS industry. Tecnisco’s expertise includes: dicing, ultrasonic machining, sandblasting, milling (drilling), assembling (AuSn, AuGe, AgCuIn, AgCu), polishing, bonding, plating, sputtering, vapor deposition and more. Their target is to be a best solution partner from trial production to mass production.
Tousimis manufactures highly reliable Supercritical CO2 Dryers. Our Critical Point Dryer (CPD) process technology eliminates surface tension forces enabling delicate 3-D micro structure preservation.
Current CPD applications include Biological, MEMS, Bio-MEMS, Aero Gel, Nano Particle, Carbon Nanotube, Graphene and others.
Tousimis also manufactures high purity fixatives and X-Ray Reference standards.
Tousimis is a USA based company supported via a global sales and service network.
Biomedical Engineering at The University of Akron is both patient-centered as well as student-focused. We seek to find solutions to pressing needs of the medical community, and we expect our students to be at the forefront of medical innovation. Within our department, we focus on three areas of specialization: Biomechanics, Biomaterials & Tissue Engineering, and Instrumentation, Signals & Imaging. Through these areas we strive to (i) better understand mechanisms of disease, (ii) develop improved technologies for diagnosing or treating diseases, and (iii) educate the next generation of biomedical engineers. Knowledge gained through this approach fuels the rapid expansion of our region’s biomedical sector.
The University of Louisville's Micro/Nano Technology Center (MNTC) is a recognized Small Times magazine top 10 multi-user core facility open for business to external businesses and academic institutions. The MNTC consists of a state-of-the-art class 100/1000 10,000 ft2 cleanroom facility, a 900 ft2 core lab for device packaging/testing and a 300 ft2 software lab dedicated to MEMS (microelectromechanical systems), microelectronic and optical device modeling/simulation. This $30M facility has over 100 available tools and gives students and researchers the capabilities to design, model, fabricate and test. We invite you to use our facility to help further your research.
Exhibit spots are fully booked for this year's event, please register as a sponsor to reserve an exhibit table.
To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $695 and includes the following:
• One (1) conference pass
• 6′ table, draped
• Two (2) chairs
• 11″x17″ custom tabletop sign with your logo and company description
• Company logo and description in the printed conference program
• Company logo and description on the conference website
• Company logo and description on several dedicated emails to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000-80,000 individuals in the MEMS, biomedical, sensors and semiconductor industry segments
• Conference proceedings in electronic format
For further information about the exhibits, please contact Bette Cooper at firstname.lastname@example.org or call 650.714.1570.
Exhibit space is limited. Sign up today!